Subnero Gen4x co-processor module (NXP i.MX8M Plus System-on-Module) in top-down view, showing its heatsink-covered ARM Cortex-A53 processor Subnero Gen4x co-processor module shown at an angle, highlighting the connector headers used to interface with the modem's main board Subnero Gen4x co-processor module shown from a top-down angle, displaying its compact circuit board layout and connector headers Subnero Gen4x co-processor module rotated to show its heatsink and corner mounting holes for integration inside the modem housing
Subnero Gen4x co-processor module thumbnail – top view with heatsink Subnero Gen4x co-processor module thumbnail – angled view of connectors Subnero Gen4x co-processor module thumbnail – top-angled circuit board view Subnero Gen4x co-processor module thumbnail – rotated view with mounting holes
Gen4x
Silver Edition

Co-processor

The Co-Processor option adds a powerful embedded computing platform directly within the Subnero modem, enabling users to deploy their own applications and algorithms with minimal effort. Designed for close hardware integration, it allows advanced processing, data management, and custom software execution within the modem — without the need for additional casing or mounting.

For more background on how this capability is used in practice, you can read our blog post on the co-processor and its applications here.

Specifications

Feature Details
Module UCM-iMX8M-Plus (NXP i.MX8M Plus System-on-Module)
Processor Quad-core ARM Cortex-A53 CPU
Memory 4 GB LPDDR4
Storage 64 GB eMMC
Operating System Linux
Connectivity Ethernet, accessible via IP network on the same subnet as the modem

Applications

  • Developing and deploying applications directly on the modem without external hardware
  • Implementing proprietary physical-layer algorithms and detectors for acoustic research
  • Running edge processing and analytics for subsea IoT systems
  • Creating autonomous behaviors or mission logic tightly integrated with modem communication
Subnero Gen4x co-processor module (NXP i.MX8M Plus System-on-Module) shown at an angle, displaying its stacked circuit boards, heatsink, and connector